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Electronics Device 2022 Scheme BEC306A VTU University 3rd SEM Electronic Communication and Engineering notes, 2022 scheme Notes, study materials, question paper

Electronics Device 2022 Scheme BEC306A VTU University 3rd SEM Electronic Communication and Engineering | BEC306A notes

BEC306A-Electronics Device 2022 Scheme BEC306A

VTU University notes on 3rd SEM Electronic Communication and Engineering 2022 scheme notes 2024. Study materials and previous year question papers on easenotes 2024.

Scheme & Syllabus Copy of Electronics Device 2022 Scheme BEC306A

Syllabus Copy of Electronics Device 2022 Scheme BEC306A

Module - 1

Semiconductors
Bonding forces in solids, Energy bands, Metals, Semiconductors and Insulators, Direct and Indirect
semiconductors, Electrons and Holes, Intrinsic and Extrinsic materials, Conductivity and Mobility, Drift and
Resistance, Effects of temperature and doping on mobility, Hall Effect.

Module - 2

PN Junctions
Forward and Reverse biased junctions-Qualitative description of Current flow at a junction, reverse bias, Reverse bias breakdown- Zener breakdown, avalanche breakdown, Rectifiers.(Text1:5.3.1,5.3.3,5.4,5.4.1,5.4.2,5.4.3)
Optoelectronic Devices Photodiodes: Current and Voltage in an Illuminated Junction, Solar Cells, Photodetectors. Light Emitting  Diode: Light Emitting Materials.

Module - 3

Bipolar Junction  Transistor
Fundamentals of BJT operation, Amplification with BJTS,BJT Fabrication, The coupled Diode model(Ebers-Moll
Model),Switching operation of a  transistor, Cutoff, saturation, switching cycle, specifications, Drift in the base
region, Base narrowing, Avalanche breakdown.

Module - 4

Field Effect  Transistors
Basic pn JFET Operation, Equivalent Circuit and Frequency Limitations, MOSFET-Two terminal MO S structureEnergy band diagram, Ideal Capacitance -Voltage Characteristics and Frequency Effects, Basic MOSFET Operation- MOSFET structure, Current-Voltage Characteristics.

Module - 5

Fabrication of p-n junctions
Thermal Oxidation, Diffusion, Rapid Thermal Processing, Ion implantation, chemical vapour deposition,
photolithography, Etching, and metallization. (Text 1: 5.1)
Integrated Circuits
Background, Evolution of ICs, CMOS Process Integration, Integration of Other Circuit Elements.